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Chemicals

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Thermal conductive filler

Magnesium compounds for thermal conductive filler

Advantages

Moisture absorbency
Moisture absorbency ※Condition: 85℃-85%RH
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Typical data
Magnesium oxide
coated with water resistant "WR Series"
Magnesium carbonate
Synthetic Magnesite "MAGTHERMO"
SL-WR P-WR PSF-WR MS-PS MS-L MS-S
Avarage particle size(μm) 9.8 3.2 1 21 8 1.2
Specific surface area(m2/g) 5 8.8 6.6 0.1 0.5 5.5
Bulk density(g/ml) 1.56 0.78 0.7 1.16 0.85 0.86
MgO(%) 97 96.3 97.5 47.6 47.4 47.4
Advantages High thermal conductivity,
good water resistivity with surface coating
High thermal conductivity and water /
acid resistant, softer than aluminium oxide.

Reference

Generally plastics have good properties for electrical application like lightness and insulation but thermal conductivity is not very high of 0.1~0.3W/m・K.
Recently electrical components become smaller, thinner and higher-integrated.

To reduce heat buildup, various fillers such as Almina(Aluminium oxide), Silica(Silicon oxide) and Boron nitride are used as thermal conductivity fillers.
And Magnesium compounds are getting popular for this application in terms of high thermal conductivity, softness and cost.

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Chemical formula Feature Performance comparison
Specific gravity Thermal conductivity
(W/m・K)
Mors hardness Thermal conductivity Hardness Water resistant Acid resistant cost
Magnesium oxide MgO 3.6 45-60 6 × ×
Magnesium carbonate MgCO3 3 15 3.5
Magnesium hydroxide Mg(OH)2 2.4 8 2.5 ×
Silicon oxide (Fused Silica) SiO2 2.6 2 6 ×
Aluminium oxide Al2O3 3.9 20-35 9 ×
Hexagonal Boron nitride BN 2.3 30-50 2 ×
Silcon nitride Si3N4 3.4 20-90 8 × ×
Aluminium nitride AlN 3.2 150-250 7 × × ×
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